تم بنجاح حدف FRP
عبر TESPOINT
HUAWEI Y7 Prime 2019
DUB-LX1
[
]
عبر TESPOINT
HUAWEI Y7 Prime 2019
DUB-LX1
[
كود:
Hydra Qualcomm Tool Ver 1.0.2 Build 72
Windows 7 Service Pack 1 (Version 6.1, Build 7601, 32-bit Edition)
Intel(R) Core(TM) i3-4005U CPU @ 1.70GHz
Intel(R) HD Graphics Family
Ram Installed : 2 GB
Windows Access Right Admin
******* Dongle Info *******
Version : Hydra Tool v 1.2
Serial : 210100011724
Initialize : OKAY
Status : Activated
Life : 0 [0-0-0-0-0]
PreOperation Configuration
Brand : AUTO Model : AUTO Storage : Auto
Loader: Auto
Port : Auto
Connection :
Searching for Qualcomm 9008 Device...Found
FriendlyName :Qualcomm HS-USB QDLoader 9008 (COM129)
SymbolicName :\??\USB#VID_05C6&PID_9008#6&9d0d236&0&3#{a5dcbf10-6530-11d2-901f-00c04fb951ed}
Driver Ver :08/31/2012,2.0.9.9
Getting device info......
Serial No.: 0x07CE02C9
MSM ID : 0x0009A0E1, SDM450-Qualcomm Snapdragon 450
PBL Ver : 00000000
PK HASH : 6BC369511DA9CADB3A7AF61574F89DB3
85003D6241BDD1FF573DBA61BF6AE119
Firehose Loader[DUB-LX1_Loader_T-Tool-Team_1.mbn]
SaharaBoot... Ok
Sending .............Ok
Connecting to Firehose...
Ping... Ok
Configuration.......
Identifying Chip....
Ok
Chip Configuration :
MemoryName : eMMC
MaxPayloadSizeToTargetInBytes : 16384
MaxPayloadSizeToTargetInBytesSupported : 16384
MaxPayloadSizeFromTargetInBytes : 4096
MaxXMLSizeInBytes : 4096
TargetName : 8953
Version : 1
*** STORAGE DEVICE INFO ***
Memory Type : eMMC
Block Size in Bytes : 512
Page Size : 512
Manufacturer ID : 21
Serial Number : 2048105370
Firmware Version : 0
Product Name : GD6BMB
Physical Partitions : 3
Total Logical Blocks:
Drive [0] 61071360[29,121 GB]
Drive [1] 8192[4 MB]
Drive [2] 8192[4 MB]
Protocol : Universal
Running : Ok
Reading GPT[3]
Drive [0] 60 Items
Drive [1] 0 Items
Drive [2] 0 Items
Processing Remove FRP....
- Removing FRP [Zero Wipe] Ok
Action Result : Ok
Elapsed Time : 00:00:08
